| FEAT |
SPECIAL FEATURES |
FOUR DIFFUSED SILICON DIODES INTERCONNECTED IN A TRANSFER-MOLDED PLASTIC ENCAPSULATED CASE,0.880 IN. MIN LG,0.920 IN. MAX LG,0.715 IN. MIN. W,0.755 IN. MAX W,0.240 IN. MIN H,0.280 IN. MAX H,FOUR RIBBON TYPE TERMINALS SPACED 0.180 IN. MIN TO 0.220 IN. MAX C TO C,ONE CENTRALLY LOCATED MTG HOLE THRU TOP OF CASE TO BOTTOM OF CASE,MTG HOLE 0.143 IN. MIN TO 0.146 IN. MAX DIA.,M65 TO P150 DEG C OPERATING TEMP,50V PEAK REVERSE VOLTAGE PER CELL,35 V SINE WAVE RMS INPUT VOLTAGE;STORAGE TEMP RANGE:MINUS 65.0 TO 150 DEG CELSIUS;UNPACKAGE WEIGHT:7.500 GRAMS |
